Introduction
  • Course content
Inception of layout - CMOS fabrication process
  • Create active regions
  • Formation of N-well and P-well
  • Formation of gate terminal
  • Lightly doped drain (LDD) formation
  • Source drain formation
  • Local interconnect formation
  • Higher level metal formation
Introduction to ‘corner stitching’ and ‘tech files’
  • INV.mag
  • min2.tech
  • Corner stitching introduction
  • Corner stitch to planes to tiles
  • Active tile types and tech file content
  • Contacts and styles
  • Connect section for circuit extraction
Design rule checking (DRC)
  • Introduction to DRC and lambda design rules
  • Poly extension and poly to diffusion spacing rules
  • Poly to diffusion spacing and diffusion contact width rules
  • Metal1 width and poly to metal1 spacing rules
  • Contact spacing and minimum active width rules
  • From logic to layout to SPICE
Introduction to euler's path and stick diagram
  • Introduction to simple path, euler's path and euler's circuit
  • Introduction to stick diagram
  • Derive actual dimension from stick diagram
Art of layout using Euler's path plus Stick diagram
  • Pre-layout simulation
  • Layout using 'only' stick diagram
  • Euler's path for Fn - Input gate ordering
  • Improved stick diagram for new gate input ordering
  • Abstract layout from stick diagram
  • Derive actual dimension for Fn
  • Script to create layout
  • draw_fn.tcl
  • Final layout and input/output labelling
Conclusion, acknowledgements and what next!!!
  • fn_prelayout.cir
  • fn_postlayout.mag
  • Post-layout simulation and conclusion